With MEMS devices continually decreasing in size while increasing in complexity, laser machining has become an essential tool for the MEMS manufacturing process. We have experience in cutting microgears, dicing micromirrors, and machining components for microsensors. Additionally, we can create micro through substrate vias or through silicon vias (TSV’s) to allow for chip stacking.
Laser machining creates the edge quality necessary for today’s complex MEMS applications. Utilizing rapid pulse technology, we are able to reduce or eliminate the heat affected zones often associated with laser processing. Highly polished wafers used in sensor applications or micromirror applications show little to no damage by processing, and can be machined to extremely small dimensions. Our advanced machining systems allow us to process various ceramic wafers, including sapphire, silicon, and fused silica.
Our current systems are capable of cutting and drilling feature sizes smaller than 5um. With the recent installation and integration of new technologies, we anticipate refining this capability to the single micron level and beyond. As MEMS technology demands greater precision, Laser Light Technologies is developing economical and practical micromachining solutions to serve the industry.